Ying Chieh Lee
National Pingtung University of Science & Technology, Taiwan
Biography
Abstract
Ni-Cr-Mn-Y-Cu resistive thin films were prepared on glass and Al2O3 substrates by DC magnetron co-sputtering from targets of Ni-Cr-Mn-Y casting alloy and Cu metals. Electrical properties and microstructures of Ni-Cr-Mn-Y-Cu films under different proportion of elements and annealing temperatures were investigated. The phase evolution, microstructural and composition of Ni-Cr-Mn-Y-Cu resistive films were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM) and Auger Electron Spectroscopy (AES). When the annealing temperature was set to 350°C, the Ni-Cr-Mn-Y-Cu films with an amorphous structure were observed. The Ni-Cr-Mn-Y films with 6.4% Cu addition annealed at 300°C which was exhibited the resistivity 770 mW-cm with +15 ppm/°C of temperature coefficient of resistance (TCR).